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Xiamen Xiongba Electronic Commerce Co., Ltd. управляет европейскими и американскими брендами модулей автоматизации, карт, CPU, PLC, DCS, продукция широко используется в электронике, металлургии, химической промышленности, электростанциях, сталелитейных заводах, резине, цементе, машинах и оборудовании, строительстве и других отраслях промышленности. 

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SIEMENS 6DD1 688-0AD0 Communication Submodule, Advanced Networking for Industrial Control

The SIEMENS 6DD1 688-0AD0 COMMUNICATION SUBMODULE is a high-performance component designed for seamless integration into industrial automation systems. This modular unit facilitates efficient data exchange, enabling enhanced system performance and reliability.

Interface:Profibus DP

Memory Type:EEPROM

Memory Capacity:64KB

Weight:0.065 kg

Size (LxWxH):120x100x30 mm

Operating Temperature Range:-25°C to +70°C

Power Consumption:≤2 W

Certifications:CE, UL, TUV

    The SIEMENS 6DD1 688-0AD0 Communication Submodule is a high-performance component tailored for demanding industrial environments. This submodule seamlessly connects various control systems, ensuring smooth data exchange and improved operational efficiency.

    Crafted with precision and durability, it supports multiple communication protocols including Profinet, Ethernet/IP, and DeviceNet, making it versatile for integration across diverse industrial setups.

    With a compact size and robust design, this submodule is capable of operating within a wide range of temperatures, from -25°C to +60°C, ensuring reliable performance in even the harshest conditions.

    Equipped with four high-speed channels, it facilitates efficient data transmission rates, reaching up to 1 Gbps, crucial for real-time control applications requiring rapid response and high throughput.

    Ease of installation and compatibility with standard connectors like DB9, DB25, and M12 make it a seamless addition to existing systems, enhancing connectivity without the need for extensive rewiring or system downtime.

SIEMENS 6DD1 688-0AD0 COMMUNICATION SUBMODULE

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